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S1.1 - Introduction to the particulate nature of matter S1.2 - The nuclear atom S1.3 - Electron configurations S1.4 - Counting particles by mass - The mole S1.5 - Ideal gases S2.1 - The ionic model S2.2 - The covalent model S2.3 - The metallic model S2.4 - From models to materials S3.1 - The periodic table - Classification of elements S3.2 - Functional groups - Classification of organic compounds R1.1 - Measuring enthalpy changes R1.2 - Energy cycles in reactions R1.3 - Energy from fuels R1.4 - Entropy and spontaneity AHL R2.1 - How much? The amount of chemical change R2.2 - How fast? The rate of chemical change R2.3 - How far? The extent of chemical change R3.1 - Proton transfer reactions R3.2 - Electron transfer reactions R3.3 - Electron sharing reactions R3.4 - Electron-pair sharing reactions

S2.4 - From models to materials

2.4.1 The Bonding Continuum 2.4.2 Using the Bonding Triangle 2.4.3 Alloys 2.4.4 Polymer and Plastic Properties 2.4.5 Addition Polymerization 2.4.6 Condensation Polymerization (AHL)

Bonding as a Continuum

Specification Reference S2.4.1

Quick Notes

  • Bonding is a spectrum, not just three separate types.
  • Most bonds fall somewhere between pure ionic, covalent, or metallic bonding.
  • The bonding triangle shows this continuum: IB Chemistry bonding triangle showing a continuum with corners for ionic (electron transfer), metallic (electron delocalization), and covalent (electron sharing).
    • Ionic corner: electrons transferred
    • Covalent corner: electrons shared
    • Metallic corner: electrons delocalized
  • A material’s structure and bonding type determine its:
    • Melting/boiling point
    • Electrical conductivity
    • Malleability or brittleness
    • Solubility

Full Notes:

The Three Bonding Models

Traditionally, bonds are classified into three types:

Bond Type Description Example
Ionic Electrons transferred between metal and non-metal NaCl
Covalent Electrons shared between non-metals H2O, CO2
Metallic Delocalized electrons between metal cations Cu, Fe

But in reality, bonding is not strictly one or the other – it exists on a continuum.

Electronegativity values of each bonded atom can be used to predict where on the continuum the bond exists.

The Bonding Triangle

The bonding triangle is a conceptual tool to show this continuum:

IB Chemistry bonding triangle showing a continuum with corners for ionic (electron transfer), metallic (electron delocalization), and covalent (electron sharing).

Corners represent pure forms of bonding:

Most substances lie between these points, showing mixed bonding character.

For Example Electronegativity and bond type

IB Chemistry diagram positioning NaCl, HCl, and Cl2 along the bonding continuum from ionic to polar covalent to non-polar covalent.

Explaining Material Properties Using Bonding Models

Bonding models help explain physical properties:

Property Ionic Covalent Metallic
Melting point High Variable (low to very high) Generally high
Electrical conductivity Conductive when molten or aqueous Usually non-conductive Conductive (solid and liquid)
Solubility Often soluble in water Soluble in non-polar solvents Insoluble in most solvents
Malleability Brittle Brittle (if giant covalent) Malleable and ductile

Linked Course Questions

Structure 3.1 – Linked Course Question

How do the trends in properties of period 3 oxides reflect the trend in their bonding?

Oxide Structure Melting Point (°C)
Na2O Giant Ionic 1275
MgO Giant Ionic 2800
Al2O3 Giant Ionic (some covalent character) 2072
SiO2 Giant Covalent 1713
P4O10 Simple Molecular 580
SO2 Simple Molecular -72
SO3 Simple Molecular 16

Explanation of the trend:

  • Ionic oxides (Na2O, MgO, Al2O3) have high melting points due to strong electrostatic forces (ionic bonding) holding the solid lattice together.
  • SiO2 has a very high melting point due to its giant covalent structure — lots of strong covalent bonds need to be broken to melt the structure, meaning high amounts of energy required.
  • Molecular oxides (P4O10, SO2, SO3) have low melting points due to weak intermolecular forces between molecules.

Application: Using the Bonding Model

When analysing a material:

Examples:

Summary